見つけられる 15 のための製品 "
ceramic scientific research 3d printer
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MakerPi ComproJet 次世代ナイロンバインダージェットプリンター サポートのないフルデンスポリアミド部品
Parameters Working Size160x60x60mm;50x50x50mm(optional);30x30x30mm(optional)Equipment Size700x560x620mmResolutionPhysical resolution 600 DPI, printing resolution 1200 DPIPrinting AccuracyDimensional accuracy 0.1-0.2mm, layer height ≥0.03mmPrinting Speed15-35 seconds per layerPositioning AccuracyPrinthead positioning accuracy 1μm, build area stitching accuracy 5μmPrinting ModesExperimental Mode,Calibration Mode,Standard ModePrinthead SystemPiezoelectric printhead with negative
MakerPi ComproJet 研究級バインダージェット 3Dプリンター デスクトップサイズ 工業性能
Parameters Working Size 160x60x60mm;50x50x50mm(optional);30x30x30mm(optional) Equipment Size 700x560x620mm Resolution Physical resolution 600 DPI, printing resolution 1200 DPI Printing Accuracy Dimensional accuracy 0.1-0.2mm, layer height ≥0.03mm Printing Speed 15-35 seconds per layer Positioning Accuracy Printhead positioning accuracy 1μm, build area stitching accuracy 5μm Printing Modes Experimental Mode,Calibration Mode,Standard Mode Printhead System Piezoelectric
MakerPi ComproJet 次世代の高性能銅Cu/ダイヤモンド複合材料製造用大型バインダージェット3Dプリンター
Industrial Binder Jetting 3D Printer for Advanced Materials Copper, Metal & Diamond Composite 3D Printing Solution A high-performance Binder Jetting 3D printing system enabling mass production of copper-diamond composite heat sinks with ultra-high thermal conductivity and complex geometries for next-generation thermal management applications. Parameters Working Size 2000×1200×1000mm Equipment Size 4890×2980×3900mm Resolution Physical resolution 600 DPI, printing resolution
MakerPi ComproJet Binder Jetting 3Dプリンター 高効率のマルチマテリアル産業用性能
Parameters Working Size 160x60x60mm;50x50x50mm(optional);30x30x30mm(optional) Equipment Size 700x560x620mm Resolution Physical resolution 600 DPI, printing resolution 1200 DPI Printing Accuracy Dimensional accuracy 0.1-0.2mm, layer height ≥0.03mm Printing Speed 15-35 seconds per layer Positioning Accuracy Printhead positioning accuracy 1μm, build area stitching accuracy 5μm Printing Modes Experimental Mode,Calibration Mode,Standard Mode Printhead System Piezoelectric
MakerPi ComproJet 大型ビルドサイズ 2000×1200×1000mm 結合機ジェット 3Dプリンティング 高性能銅ダイヤモンドヒートシンク
Industrial Binder Jetting 3D Printer for Advanced Materials Copper, Metal & Diamond Composite 3D Printing Solution A high-performance Binder Jetting 3D printing system enabling mass production of copper-diamond composite heat sinks with ultra-high thermal conductivity and complex geometries for next-generation thermal management applications. Parameters Working Size 2000×1200×1000mm Equipment Size 4890×2980×3900mm Resolution Physical resolution 600 DPI, printing resolution
MakerPi ComproJet 研究級 BJ 結合器ジェット 3D プリンティング システム
Parameters Working Size 160x60x60mm;50x50x50mm(optional);30x30x30mm(optional) Equipment Size 700x560x620mm Resolution Physical resolution 600 DPI, printing resolution 1200 DPI Printing Accuracy Dimensional accuracy 0.1-0.2mm, layer height ≥0.03mm Printing Speed 15-35 seconds per layer Positioning Accuracy Printhead positioning accuracy 1μm, build area stitching accuracy 5μm Printing Modes Experimental Mode,Calibration Mode,Standard Mode Printhead System Piezoelectric
