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品質 MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 工場
品質 MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 工場

MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing

ブランド名: MakerPi
モデル番号: コンプロジェット
原産地: 広東省、中国
認証: CE Fcc RoHS
最低注文数量: 1
価格: $36,765
補給能力: 10台
支払い条件: T/T、L/C、ウェスタンユニオン、マネーグラム


Industrial Binder Jetting 3D Printer for Advanced Materials Copper, Metal & Diamond Composite 3D Printing Solution

A high-performance Binder Jetting 3D printing system enabling mass production of copper-diamond composite heat sinks with ultra-high thermal conductivity and complex geometries for next-generation thermal management applications.
Parameters
Working Size
2000×1200×1000mm
Equipment Size
4890×2980×3900mm
Resolution
Physical resolution 600 DPI, printing resolution 1200 DPI
Printing Accuracy
Dimensional accuracy 0.1-0.2mm, layer height ≥0.03mm
Printing Speed
15-35 seconds per layer
Positioning Accuracy
Printhead positioning accuracy 1μm, build area stitching accuracy 5μm
Printhead System
Piezoelectric printhead with negative-pressure ink delivery system
Supported Materials
Metal powders, ceramic powders, polymers, sand,pharmaceuticals, food, biological solutions, cell solutions, wax, cu–diamond composite, and more
Addition Functions
Printhead cleaning, printhead moisturizing,print baking (UV,IR), and cylinder heating
Workflow
MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 0

Spreading Powder Jet Adhesive

Evenly Spread A Thin Layer The Spray Head Accurately Of Powder (The Material Sprays Liquid Adheslve In
Can Be Metal, Ceramic, The Specified Area Based
Sand Casting, Polymer, Etc.) On The Sliced Data Of The
On The Printing Platform. Digital Model, Causing
Local Adhesion Of The
Power Particles.
MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 2

Repeat Layer By Layer After Processing

Repeat The Steps Of Applying Remove The Printout, Powder And Spraying Eliminate The Loose Adhesive Until All Layers Are Powder That Has Not Completed. Adhered,And Enhance The Strength Through
Processes Such As
Sintering, Infiltration,
Or Curing.
Features
MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 4

A.Material Diversity

Supports A Variety Of Materials Including Metals, Ceramics, Sand,Polymens, Medical Powders, Gypsum, And More.
MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 6

B.High Efficiency

Adopting A Spray Head Array For Full Coverage Printing Significantly Improves Printing Speed, Making It Suitable For Largn-scale Rapid Manulacturing.
MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 8

C.No Support Needed

Print Various Complex Structures Without Support.
MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 10

D.Low Cost

It Has Advantages In Terms Of Equipment Cost, Usage Cost, And Maintenance Cost.
MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 12

E.Avoid High Temperatures

No Need For Laser Melting Of Materials, Making It Friendly To Temperature-sensitive Materials.
MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 14

F.High Solid Content

High Solid Content Results In Less Shrinkage, Higher Density, And Higher Strength After Degreasing Sintering.
Equipment Selling Points
MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 16

A.Industry Level

Industry-size (2000×1200×1000mm], Industrial-grade Performance,Multi-parameter, Digital, Multi-mode, Micro-experiment, Expancable,High Cost-eflectiveness.
MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 18

B.Customizablo

With Independent Intellectual Property Rights, We Offer Flexible Customization Solutions To Meet Diverse Needs.
MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 20

C.Expandable

The Powder Spreading Module And Inkjet Module Are Designed Independently And Modularly For Easy Expansion,
MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 22

D.Industrial-Grade Performance

Equipped With An Industrial-grade Piezoelectric Printhead (RicohG5) System, Linear Motor System, And Ipm-level Positioning Accurcy.
MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 24

E.Negative Pressure System

Effectively Prevents Ink From Flowing Or Dripping, Ensuring High Ink Viscosity Compatibility And Precite Droplet Control, Meeting The Demands For High-precision And High-stability Printing.
MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 26

F.Multi-Material Compatibility

Supports A Wiide Range Of Materials, Including Metals, Ceramics,Polymers, Sand, Phammaceuticals, Foad, Biclagical Solutions, Cell Solutions, And Wax.
MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 28

G.Ultra-Size

Compatibility; Supports Suoer Big Working Dimensions,
2000×1200×1000mm
MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 30

H.Double Powder Warehouse

Featurres A Dual-cylinder Structure With A Forming Cylinder And A Stability.Materlal Cylinder For Enhanced Convenience, Efficlency, And Stability.

Other Functions:

Print Head Cleaning, Print Head Moisturizing, Baking During Printing, Powder Warehouse Heating
Application
MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 32
Aerospace
Production Of Complex-structured Metal Components (E.G, Aerospace Parts).
MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 34

Scientific Research & Exporimontation

New Materials, New Processes, Muliti-materials, And Interdisciplinary Scientific Research Applications
MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 36
Medical Field
Customized Ceramic Implants Or Bone Models.
MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 38
Architectural Models
Printing Architectural Prototypes Or Artistic Installations Using Gypsum Or Sand.
MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 40
Foundry Industry
Rapid Manufacturing Of Sand Casting Molds And Cores (E.G., Automative Engine Cylinder Casting).
MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 42
Consumer Goods
Low-cost Production Of Jewelry Or Functional Prototypes.
Print Product Display
MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing 44
生産能力: 5単位/月 Supporting Material: 金属、セラミックス、砂、ポリマーなど
応用: プロトタイピング 建築 材料: 金属、セラミックス、砂
ボリュームを構成する: 2000×1200×1000mm 状態: 新しい
接続性: 有線 コネクタの種類: USB
寸法(長さ*幅*高さ): カスタマイズ フィラメントタイプ: 砂、金属、セラミックス、Cu/ダイヤモンド複合体など
入力電力: 電源アダプター オペレーティング·システム: Windows OS、Linux、MacOS、その他
プレートタイプ: フラットベッド 仕様をプラグします: USプラグ、UKプラグ、AUプラグ、日本プラグ、EUプラグ
印刷技術: バインダージェッティング プリンター接続テクノロジー: USB、WIFI
使用法: マテリアルプリンター、セラミックプリンター、サンドプリンター、ポリマープリンター 電圧: 110V/220V
保証: 1年 重さ: 100
印刷 材料: 金属、セラミック、砂、ポリマー、医療用粉末、石膏など 製品サイズ: 4890×2980×3900mm
梱包サイズ: 5090×3180×4100mm 解決: 物理解像度 600 DPI、印刷解像度 1200 DPI
プリントヘッド システム: 負圧インク供給システムを備えた圧電プリントヘッド 印刷モード: 実験モード、キャリブレーションモード、標準モード
印刷精度: 寸法精度0.1~0.2mm、層高さ≧0.03mm 位置決め精度: プリントヘッドの位置決め精度 1μm
特別な機能: プリントヘッドのクリーニング、プリントヘッドの保湿