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binder jetting heat sink printer

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Quality MakerPi ComproJet Heat Sink 3D Printer Binder Jetting for Metal Sand Ceramics Scientific Research Printing with High Efficiency factory

MakerPi ComproJet Heat Sink 3D Printer Binder Jetting for Metal Sand Ceramics Scientific Research Printing with High Efficiency

Parameters Working Size 160x60x60mm;50x50x50mm(optional);30x30x30mm(optional) Equipment Size 700x560x620mm Resolution Physical resolution 600 DPI, printing resolution 1200 DPI Printing Accuracy Dimensional accuracy 0.1-0.2mm, layer height 0.03mm Printing Speed 15-35 seconds per layer Positioning Accuracy Printhead positioning accuracy 1m, build area stitching accuracy 5m Printing Modes Experimental Mode,Calibration Mode,Standard Mode Printhead System Piezoelectric
Quality MakerPi ComproJet Large Build Size 2000×1200×1000mm Binder Jetting 3D Printing for High-Performance Copper Diamond Heat Sinks factory

MakerPi ComproJet Large Build Size 2000×1200×1000mm Binder Jetting 3D Printing for High-Performance Copper Diamond Heat Sinks

Industrial Binder Jetting 3D Printer for Advanced Materials Copper, Metal & Diamond Composite 3D Printing Solution A high-performance Binder Jetting 3D printing system enabling mass production of copper-diamond composite heat sinks with ultra-high thermal conductivity and complex geometries for next-generation thermal management applications. Parameters Working Size 200012001000mm Equipment Size 489029803900mm Resolution Physical resolution 600 DPI, printing resolution
Quality MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing factory

MakerPi ComproJet Next-Generation Large-Scale Binder Jet 3D Printer for High-Performance Copper Cu/Diamond Composites Manufacturing

Industrial Binder Jetting 3D Printer for Advanced Materials Copper, Metal & Diamond Composite 3D Printing Solution A high-performance Binder Jetting 3D printing system enabling mass production of copper-diamond composite heat sinks with ultra-high thermal conductivity and complex geometries for next-generation thermal management applications. Parameters Working Size 200012001000mm Equipment Size 489029803900mm Resolution Physical resolution 600 DPI, printing resolution